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Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
View  |  Adobe PDF(165Kb)  |  Favorite  |  View/Download:112/24  |  Submit date:2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination  
Multi-Scale Characterizations for Ductile Thin Film Delamination 会议论文
IUTAM Symposium on Size Effects on Material and Structural Behavior at Micron- and Nano-Scales, MAY 31-JUN 04, 2004 Hong Kong Univ Sci & Technol, Hong Kong, PEOPLES R CHINA
Authors:  Wei YG(魏悦广);  Xu GS
Adobe PDF(295Kb)  |  Favorite  |  View/Download:637/202  |  Submit date:2007/12/18
Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates 会议论文
SURFACE ENGINEERING 2001 - FUNDAMENTALS AND APPLICATIONS, 2001
Authors:  Wei YG(魏悦广)
View  |  Adobe PDF(139Kb)  |  Favorite  |  View/Download:523/125  |  Submit date:2007/06/15