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Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models 期刊论文
International Journal of Solids and Structures, 2008, 页码: 3779-3792
Authors:  Wei YG(魏悦广);  Zhao HF(赵海峰);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
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Peel Experiment  Metal Thin Film  Analytical Model  Interfacial Fracture Energy  Pressure-sensitive Adhesive  Strain Gradient Plasticity  State Crack-growth  Fracture Criterion  Cantilever Beam  Round-robin  Work  Toughness  Strength  Surface  
Investigations of cohesive zone properties of the interface between metal film and ceramic substrate at nano- and micro-scales 会议论文
International Conference on Heterogeneous Material Mechanics (ICHMM), Huangshan, PEOPLES R CHINA, JUN 03-08, 2008
Authors:  Wei YG(魏悦广);  You XM;  Zhao HF;  Wei YG
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Cohesive Zone  Energy Release Rate  Interface Energy  Peel Test  Peel Test  
Inverse Analysis Determining Interfacial Properties Between Metal Film And Ceramic Substrate With An Adhesive Layer 期刊论文
Acta Mechanica Sinica, 2008, 卷号: 24, 期号: 3, 页码: 297-303
Authors:  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech LNM, Beijing 100080, Peoples R China.
Adobe PDF(648Kb)  |  Favorite  |  View/Download：685/215  |  Submit date：2009/08/03
Thin Film  Peel Test  Interface Toughness  Cohesive Zonemodel  Inverse Analysis  Peel Test  Cu/cr/polyimide System  Fracture Energy  Thin-films  Strength  Joints  Simulations  Plasticity  Surface  Model  
Determination Ofinterfacial Mechanical Parameters For An Al/Epoxy/Al2O3 System Byusing Peel Test Simulations 期刊论文
Acta Mechanica Solida Sinica, 2008, 页码: 198-206
Authors:  You XM(尤雪梅);  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(345Kb)  |  Favorite  |  View/Download：672/142  |  Submit date：2009/08/03
Peel Test  Interface Toughness  Cohesive Zone Model  Energy Release Rate  Ductile Thin-films  Cu/cr/polyimide System  Adhesive Joints  Fracture Energy  Ceramic Substrate  Metal-film  Strength  Layer  Plasticity  Surface  
8.05 - Peel Test and Interfacial Toughness 图书章节
2007
Authors:  Wei YG(魏悦广);  Hutchinson JW
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Microstructure and microhardness in surface-nanocrystalline Al-alloy material 图书章节
2007
Authors:  Wei YG(魏悦广);  Wu XL(武晓雷);  Zhu C;  Zhao MH
Adobe PDF(2198Kb)  |  Favorite  |  View/Download：159/40  |  Submit date：2020/11/19
Microstructure  Nanoindentation test  Size effect  Surface-nanocrystalline Al-alloy  TEM observation  
Determination of interface properties between micron-thick metal film and ceramic substrate using peel test 期刊论文
International Journal of Fracture, 2007, 卷号: 144, 期号: 2, 页码: 103-112
Authors:  Zhao HF(赵海峰);  Wei YG(魏悦广);  Zhao, HF (reprint author), Chinese Acad Sci, State Key Lab Nonlinear Mech LNM, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(591Kb)  |  Favorite  |  View/Download：630/178  |  Submit date：2009/08/03
Interfacial Toughness  Metal Thin Film  Peel Test  Cohesive Zone Model  Inverse Analysis  Strain Gradient Plasticity  State Crack-growth  Cu/cr/polyimide System  Adhesive Joints  Fracture Energy  Strength  Layer  Work  Simulations  Surface  
Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate 会议论文
IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials, Beijing, PEOPLES R CHINA, JUN 27-30, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ;  Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
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Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
Adobe PDF(165Kb)  |  Favorite  |  View/Download：115/25  |  Submit date：2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination  
Multi-Scale Characterizations for Ductile Thin Film Delamination 会议论文
IUTAM Symposium on Size Effects on Material and Structural Behavior at Micron- and Nano-Scales, MAY 31-JUN 04, 2004 Hong Kong Univ Sci & Technol, Hong Kong, PEOPLES R CHINA
Authors:  Wei YG(魏悦广);  Xu GS
Adobe PDF(295Kb)  |  Favorite  |  View/Download：641/203  |  Submit date：2007/12/18