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Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
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Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation  
Flow in membrane filter simulated as microchannel flow with diaphragm 会议论文
22nd International Symposium on Rarefied Gas Dynamics, SYDNEY, AUSTRALIA, JUL 09-14, 2000
Authors:  Liu HL(刘宏立);  Xie C(谢翀);  Shen Q(沈青);  Fan J(樊菁);  Liu, HL (reprint author), Chinese Acad Sci, Inst Mech, Lab High Temp Gas Dynam, Beijing 100080, Peoples R China.
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Hypersonic flow around a sphere with CLL model of incomplete energy accommodation 会议论文
22nd International Symposium on Rarefied Gas Dynamics, SYDNEY, AUSTRALIA, JUL 09-14, 2000
Authors:  Liu HL(刘宏立);  Shen Q(沈青);  Liu, HL (reprint author), Chinese Acad Sci, Inst Mech, High Temp Gas Dynam Lab, Beijing 100080, Peoples R China.
View  |  Adobe PDF(480Kb)  |  Favorite  |  View/Download：167/79  |  Submit date：2016/06/30