×
验证码:
换一张
Forgotten Password?
Stay signed in
China Science and Technology Network Pass Registration
×
China Science and Technology Network Pass Registration
Log In
Chinese
|
English
中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
Log In
Register
ALL
ORCID
Title
Creator
Thesis Advisor
Keyword
Document Type
Source Publication
Publisher
Date Issued
Date Accessioned
Indexed By
Funding Project
DOI
Study Hall
Image search
Paste the image URL
Home
Collections
Authors
DocType
Subjects
K-Map
News
Search in the results
Collection
力学所知识产出(19... [1]
State Key ... [1]
Creator
Liu S [1]
何国威 [1]
张星 [1]
汪海英 [1]
王士召 [1]
王建军 [1]
More...
Document Type
Conference... [2]
Date Issued
2012 [1]
2001 [1]
Language
英语 [2]
Source Publication
Abstract B... [1]
Proceeding... [1]
Indexed By
Funding Project
Funding Organization
Thesis Advisor
×
Knowledge Map
IMECH-IR
Start a Submission
Submissions
Unclaimed
Claimed
Attach Fulltext
Bookmarks
QQ
Weibo
Feedback
Browse/Search Results:
1-2 of 2
Help
Filters
Language:英语
Document Type:会议论文
Selected(
0
)
Clear
Items/Page:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
Sort:
Select
Submit date Ascending
Submit date Descending
WOS Cited Times Ascending
WOS Cited Times Descending
Title Ascending
Title Descending
Issue Date Ascending
Issue Date Descending
Author Ascending
Author Descending
Journal Impact Factor Ascending
Journal Impact Factor Descending
Spanwise stretching and collapse motions stabilize leading-edge vortex in slow-flying bats
会议论文
23rd International Congress of Theoretical and Applied Mechanics, 中国北京/Beijing, China, 2012-08-19
Authors:
Wang SZ(王士召)
;
He GW(何国威)
;
Zhang X(张星)
Adobe PDF(361Kb)
  |  
Favorite
  |  
View/Download:443/122
  |  
Submit date:2014/04/02
Stretching
Stabilize
Flying
Leading
Collapse
Vortex
Oscillating
Stable
Slowing
Still
Simulate
Observed
Morphology
Around
Motion
Where
Taken
Method
Study
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages
会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors:
Wang HY(汪海英)
;
Wang JJ(王建军)
;
Liu S
;
Zhao YP(赵亚溥)
Adobe PDF(691Kb)
  |  
Favorite
  |  
View/Download:371/89
  |  
Submit date:2014/02/14
Solder
Underfill
Filled
0
Outmost
Substrate
0
Fatigue
Package
Understand
Joints
Thermal
Lives
0
Silicon
Reliability
Range
0
Different
Smaller
Corners
Studied
Assumed
Simulation