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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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力学所知识产出(19... [1]
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汪海英 [1]
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Thesis [1]
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2001 [1]
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中文 [1]
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[博士论文].北京.... [1]
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白以龙 [1]
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电子封装中的不流动芯下材料力学性能和封装可靠性的研究
学位论文
博士论文,北京: 中国科学院研究生院, 2001
Authors:
汪海英
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Submit date:2009/04/13
可控坍塌倒装芯片互连技术
芯下材料
机械性能
颗粒含量
颗粒沉积
焊点寿命c4
Underfill
Mechanical Properties
Filler Content
Particle Settling
Solder Joints'life