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Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer 期刊论文
Thin Solid Films, 2004, 卷号: 460, 期号: 1, 页码: 175-180
Authors:  Zhou Y;  Yang CS;  Chen JA;  Ding GF,;  Ding W;  Wang L;  Wang MJ;  Zhang YM;  张泰华
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