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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：332/185  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Crack propagation speed in ceramic during quenching 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2018, 卷号: 38, 期号: 7, 页码: 2879-2885
Authors:  Shao YF(邵颖峰);  Liu BY;  Wang XH;  Li L(李龙);  Wei JC(韦佳辰);  Song F(宋凡)
View  |  Adobe PDF(2717Kb)  |  Favorite  |  View/Download：319/130  |  Submit date：2018/07/17
Ceramic  Thermal Shock  Crack Speed  Numerical Simulation  Real-time  
Oscillation flow induced by underwater supersonic gas jets 期刊论文
Shock Waves, 2010, 卷号: 20, 期号: 4, 页码: 347-352
Authors:  Shi HH(施红辉);  Guo QA;  Wang C(王超);  Dong RL;  Zhang LT;  Jia HX;  Wang XG;  Wang BY(王柏懿);  Shi HH
View  |  Adobe PDF(628Kb)  |  Favorite  |  View/Download：764/207  |  Submit date：2011/03/01
Underwater Supersonic Gas Jet  Jet Expansion Feedback  Jet Bulge  High-speed Photography  Water  Injection  Liquid  
Research on the mechanics of underwater supersonic gas jets 期刊论文
Science China-Physics Mechanics & Astronomy, 2010, 卷号: 53, 期号: 3, 页码: 527-535
Authors:  Shi HH(施红辉);  Wang BY(王伯懿);  Dai ZQ;  Shi HH
Adobe PDF(909Kb)  |  Favorite  |  View/Download：725/239  |  Submit date：2011/03/01