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A Quantitative Representation of Damage and Failure Response of Three-Dimensional Textile SiC/SiC Ceramics Matrix Composites Subjected to Flexural Loading 期刊论文
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 2023, 卷号: 145, 期号: 3, 页码: 31001
Authors:  Yang ZM(杨正茂);  Pang, Keji;  Lei XQ(雷现奇);  Hu, Qing
Adobe PDF(1147Kb)  |  Favorite  |  View/Download：105/7  |  Submit date：2023/06/15
ceramic matrix composites  silicon carbide  mechanical behavior  microstructure deformation  damage modeling/model  flexural loading  
Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics 期刊论文
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2022, 卷号: 304, 页码: 14
Authors:  Hu, Zhongwei;  Chen, Yue;  Lai, Zhiyuan;  Yu, Yiqing;  Xu, Xipeng;  Peng Q(彭庆);  Zhang, Long
Adobe PDF(16353Kb)  |  Favorite  |  View/Download：181/43  |  Submit date：2022/08/10
Single-crystal silicon carbide  Vibration-assisted scratch  Double abrasive grains  Molecular dynamics  
An in situ system for simultaneous stress measurement and optical observation of silicon thin film electrodes 期刊论文
JOURNAL OF POWER SOURCES, 2019, 卷号: 444, 页码: 5
Authors:  Chen J;  Yang L;  Han Y;  Bao YH;  Zhang KL;  Li X;  Pang J;  Chen HS;  Song WL;  Wei YJ(魏宇杰);  Fang DN
View  |  Adobe PDF(774Kb)  |  Favorite  |  View/Download：462/156  |  Submit date：2020/03/11
Lithium ion batteries  Silicon film  Multi-beam optical sensor (MOS)  in situ stress measurement  Colorimetric method  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：325/182  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis