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Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
Authors:  Long X;  Hu B;  Feng YH(冯义辉);  Chang C;  Li MY
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Silver nanoparticles  Silver microparticles  Nanoindentation  Microstructure  Constitutive behaviour  
Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder 期刊论文
MICROMACHINES, 2018, 卷号: 9, 期号: 11, 页码: Ar-608
Authors:  Long X;  Zhang XD;  Tang WB;  Wang SB;  Feng YH(冯义辉);  Chang C
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nanoindentation  constitutive model  rate factor  dimensionless analysis  solder  
Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 140, 页码: 60-67
Authors:  Long X;  Tang WB;  Feng YH(冯义辉);  Chang C;  Keer LM;  Yao Y
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Silver Nanoparticles  Strain Rate Sensitivity  Nanoindentation  Strain Rate Sensitivity  Creep Strain Rate  Stress Exponent  
Spherical indentation method for estimating equibiaxial residual stress and elastic-plastic properties of metals simultaneously 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2018, 卷号: 33, 期号: 8, 页码: 884-897
Authors:  Peng GL;  Lu ZK;  Ma Y;  Feng YH(冯义辉);  Huan Y(郇勇);  Zhang TH(张泰华)
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Verification of a novel micro-torsion tester based on electromagnetism using an improved torsion pendulum technique 期刊论文
MEASUREMENT, 2017, 卷号: 105, 页码: 41-44
Authors:  Liu W;  Huan Y(郇勇);  Wang SF;  Chen B;  Dong J;  Feng YH(冯义辉);  Lan D(蓝鼎);  Jia HY;  Huan, Y (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech LNM, Beijing 100190, Peoples R China.
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Micro-torsion  Shear Modulus  Torsion Pendulum  Copper Wire  
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
Authors:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
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Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour  
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
Authors:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
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Lead-free Solder  Cooling Condition  Annealing  Mechanical Property  Residual Stress  
Nanoindentation investigation on creep behavior of amorphous Cu-Zr-AI/nano crystalline Cu nanolaminates 期刊论文
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2017, 卷号: 465, 页码: 42963
Authors:  Ma Y;  Peng GJ(彭光健);  Feng YH(冯义辉);  Zhang TH(张泰华);  Zhang, TH (reprint author), Zhejiang Univ Technol, Coll Mech Engn, Inst Micro Nanomech Testing Technol & Applicat, Hangzhou 310014, Zhejiang, Peoples R China.
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Nanolaminates  Amorphous Alloy  Nanoindentation  Creep  Strain Rate Sensitivity  
On the spherical nanoindentation creep of metallic glassy thin films at room temperature 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 685, 页码: 294-299
Authors:  Zhang TH(张泰华);  Ye JH;  Feng YH(冯义辉);  Ma Y;  Ma, Y (reprint author), Zhejiang Univ Technol, Coll Mech Engn, Inst Micro Nanomech Testing Technol & Applicat, Hangzhou 310014, Zhejiang, Peoples R China.
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Nanoindentation  Creep  Metallic Glassy Film  Strain Rate Sensitivity  Shear Transformation Zone  
Nanoindentation study on the creep characteristics of high-entropy alloy films: fcc versus bcc structures 期刊论文
INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2016, 卷号: 54, 页码: 395-400
Authors:  Ma Y;  Feng YH(冯义辉);  Debela TT;  Peng GJ;  Zhang TH(张泰华);  Zhang, TH (reprint author), Zhejiang Univ Technol, Coll Mech Engn, Hangzhou 310014, Zhejiang, Peoples R China.
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High-entropy Alloys  Nanoindentation  Creep  Strain Rate Sensitivity  Activation Volume