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Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 9, 页码: 3169-3175
Authors:  Chen SD;  Ke FJ(柯孚久);  Zhou M;  Bai YL(白以龙);  Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(3490Kb)  |  Favorite  |  View/Download：1002/398  |  Submit date：2009/08/03
Diffusion Bonding  Molecular Dynamics  Temperature Effect  Tensile Strength  Molecular-dynamics Simulation  Embedded-atom-method  Theoretical-model  Interface  Alloys  Copper  Metals  Ni  
Size Dependent Nanoindentation of a Soft Film on a Hard Substrate 期刊论文
Acta Materialia, 2004, 卷号: 52, 期号: 5, 页码: 1089-1095
Authors:  Chen SH(陈少华);  Liu L(刘磊);  Wang ZQ(王自强);  Chen, SH (reprint author), Chinese Acad Sci, Inst Mech, LNM, 15 Beisihuan Xilu, Beijing 100080, Peoples R China.
Adobe PDF(232Kb)  |  Favorite  |  View/Download：685/253  |  Submit date：2007/06/15
Microstructure and Evolution of Mechanically-Induced Ultrafine Grain in Surface Layer of Al-Alloy Subjected to USSP 期刊论文
Acta Materialia, 2002, 卷号: 50, 期号: 8, 页码: 2075-2084
Authors:  Wu XL(武晓雷);  Tao N;  Hong YS(洪友士);  XU B;  LU J;  Lu K;  Wu, X (reprint author), Cleveland State Univ, Dept Chem Engn, 1960 E24th St,SH455, Cleveland, OH 44115 USA.
Adobe PDF(804Kb)  |  Favorite  |  View/Download：1279/284  |  Submit date：2007/06/15