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The scratch characteristics of laser nitrided Zr-based metallic glass surface 期刊论文
INTERMETALLICS, 2023, 卷号: 155, 页码: 13
Authors:  Hong, Jing;  Wu, Haoxiang;  Huang, Hu;  Zhang, Lin;  Zhang ZY(张治愚);  Jiang MQ(蒋敏强);  Yan, Jiwang
Adobe PDF(24413Kb)  |  Favorite  |  View/Download:106/5  |  Submit date:2023/03/15
Metallic glass  Laser processing  Tribological properties  Mechanical properties  Scratch  
Bioinspired staggered-array structure design for flexible batteries 期刊论文
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2022, 卷号: 256, 页码: 16
Authors:  Li S(李爽);  Li,Rui;  An,Dongqi;  Wang YK(王勇康);  Xu XK(徐新凯);  Xue,Riye;  Su YW(苏业旺)
Adobe PDF(9459Kb)  |  Favorite  |  View/Download:238/64  |  Submit date:2022/11/14
Flexible battery  Bioinspired structure  Staggered array  Analytic model  Bulk volume  
Contact-Resistance-Free Stretchable Strain Sensors with High Repeatability and Linearity 期刊论文
ACS NANO, 2022, 卷号: 16, 期号: 1, 页码: 541-553
Authors:  Li S(李爽);  Liu GD(刘国栋);  Li, Rui;  Li QL(李沁蓝);  Zhao Y(赵阳);  Huang, Mingqi;  Zhang MY(张懋意);  Yin SZ(尹世珍);  Zhou, Yixin;  Tang, Hao;  Wang, Liwu;  Fang, Guanhui;  Su YW(苏业旺)
Adobe PDF(8626Kb)  |  Favorite  |  View/Download:2337/2001  |  Submit date:2022/02/17
flexible electronics  stretchable strain sensors  high repeatability  high linearity  Tianwen-1  
Surface functionalization of Zr-based metallic glass by direct nanosecond laser texturing 期刊论文
VACUUM, 2021, 卷号: 194, 页码: 4
Authors:  Qian, Yongfeng;  Jiang MQ(蒋敏强);  Zhang, Zhiyu;  Huang, Hu;  Yan, Jiwang
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Functional property  Metallic glass  Micro  nano-structure  Pulsed laser  
Numerical analysis of deep hole multi-stage cut blasting of vertical shaft using a continuum-based discrete element method 期刊论文
ARABIAN JOURNAL OF GEOSCIENCES, 2021, 卷号: 14, 期号: 12, 页码: 11
Authors:  Ding, Chenxi;  Yang, Renshu;  Zheng, Changda;  Yang, Liyun;  He, Songlin;  Feng C(冯春)
Adobe PDF(1348Kb)  |  Favorite  |  View/Download:241/57  |  Submit date:2021/08/03
Vertical shaft  Cut blasting  Continuum-based discrete element method  Fractal damage  Fracture degree  
Effect of Substrate Microstructure on Thermocapillary Flow and Heat Transfer of Nanofluid Droplet on Heated Wall 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2021, 卷号: 33, 期号: 3, 页码: 10
Authors:  Jiang, Yanni;  Chi, Faxuan;  Chen QS(陈启生);  Zhou, Xiaoming
Adobe PDF(1467Kb)  |  Favorite  |  View/Download:294/77  |  Submit date:2021/06/15
Droplet  Substrate microstructure  Nanofluid  Thermocapillary convection  Two-phase mixture model  Heat transfer  
Numerical study of turbulent flow past a rotating axial-flow pump based on a level-set immersed boundary method 期刊论文
RENEWABLE ENERGY, 2021, 卷号: 168, 页码: 960-971
Authors:  Kan, Kan;  Yang ZX(杨子轩);  Lyu, Pin;  Zheng, Yuan;  Shen, Lian
Adobe PDF(2360Kb)  |  Favorite  |  View/Download:391/174  |  Submit date:2021/03/30
Axial-flow pump  Large-eddy simulation  Immersed boundary method  Level set function  Turbulent kinetic energy  Flow separation  
Study of shock train/flame interaction and skin-friction reduction by hydrogen combustion in compressible boundary layer 期刊论文
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2020, 卷号: 45, 期号: 31, 页码: 15683-15696
Authors:  Xue R(薛瑞);  Zheng X;  Yue LJ(岳连捷);  Zhang SK;  Weng C
Adobe PDF(3251Kb)  |  Favorite  |  View/Download:374/114  |  Submit date:2020/07/06
Compressible boundary layer combustion  Skin-friction reduction  Shock train/flame interaction  
Efficient strategy for reliability-based optimization design of multidisciplinary coupled system with interval parameters 期刊论文
APPLIED MATHEMATICAL MODELLING, 2019, 卷号: 75, 页码: 349-370
Authors:  Wang RX(王睿星);  Luo Y
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Multidisciplinary design optimization  Non-probabilistic reliability  Uncertainty propagation analysis  Gradient information  Interval reliability displacement  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download:332/185  |  Submit date:2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis