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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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力学所知识产出(19... [1]
Creator
Liu S [1]
汪海英 [1]
王建军 [1]
赵亚溥 [1]
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Conference... [1]
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2001 [1]
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英语 [1]
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Date Issued：2001
Language：英语
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Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages
会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors:
Wang HY(汪海英)
;
Wang JJ(王建军)
;
Liu S
;
Zhao YP(赵亚溥)
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Submit date：2014/02/14
Solder
Underfill
Filled
0
Outmost
Substrate
0
Fatigue
Package
Understand
Joints
Thermal
Lives
0
Silicon
Reliability
Range
0
Different
Smaller
Corners
Studied
Assumed
Simulation
