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The Effect of Bond Number To Critical Marangoni Number 会议论文
5th China-Japan Workshop on Microgravity Sciences, Dunhuang,Gansu Province, China, 2002-9-1
Authors:  Cao ZH(曹重华);  A Y(阿燕);  Tang ZM(唐泽眉);  Hu WR(胡文瑞)
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Marangoni  Numb  Profile  0  
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
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Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation  
A modified split hopkinson torsional bar in studying shear localization 期刊论文
Measurement Science & Technology, 1995, 卷号: 6, 期号: 11, 页码: 1557-1565
Authors:  Xue Q(薛青);  Shen LT(沈乐天);  Bai YL(白以龙);  XUE, Q (reprint author), CHINESE ACAD SCI,INST MECH,NONLINEAR MECH CONTINUOUS MED LAB,BEIJING 100080,PEOPLES R CHINA.
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1100-0 Aluminum  Strain-rate  Stress  
Elimination of loading reverberation in the split hopkinson torsional bar 期刊论文
Review of Scientific Instruments, 1995, 卷号: 66, 期号: 11, 页码: 5298-5304
Authors:  Xue Q(薛青);  Shen LT(沈乐天);  Bai TL;  XUE, Q (reprint author), CHINESE ACAD SCI, INST MECH, NONLINEAR MECH CONTINUOUS MEDIA LAB, BEIJING 100080, PEOPLES R CHINA.
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1100-0 Aluminum  Strain-rate  Stress