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New analytic buckling solutions of rectangular thin plates with two free adjacent edges by the symplectic superposition method 期刊论文
EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2019, 卷号: 76, 页码: 247-262
Authors:  Li R(李睿);  Wang HY;  Zheng XR;  Xiong SJ;  Hu ZY;  Yan XY;  Xiao Z;  Xu HL;  Li P
View  |  Adobe PDF(3849Kb)  |  Favorite  |  View/Download：301/132  |  Submit date：2019/09/09
Analytic solution  Plate buckling  Free edge  Free comer  Symplectic superposition method  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：324/182  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis