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| Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
作者: Wang Q; NieY; Shao YF(邵颖峰) ; LiuHZ; HuXQ; LiDZ
 Adobe PDF(18909Kb) |  收藏 | 浏览/下载：237/32 | 提交时间：2022/03/28
Ultrasound Solid phase welding Plastic deformation Amorphous Intermetallic compound |
| Strain distribution and lattice rotations during in-situ tension of aluminum with a transmodal grain structure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 828, 页码: 11
作者: Gao, W. Q.; Zhang, C. L.; 杨沐鑫.; Zhang, S. Q.; Jensen, D. Juul; Godfrey, A.
Adobe PDF(8128Kb) | 收藏 | 浏览/下载：268/76 | 提交时间：2021/11/01
Heterogenous grain structure Strain distribution High-resolution digital image correlation (HR-DIC) Near-micrometer grain size Electron backscatter diffraction (EBSD) |
| Ultra-high tensile strength via precipitates and enhanced martensite transformation in a FeNiAlC alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 803, 页码: 10
作者: Ma Y(马彦); Zhou LL(周玲玲); Yang MX(杨沐鑫); Yuan FP(袁福平); Wu XL(武晓雷)
Adobe PDF(19779Kb) | 收藏 | 浏览/下载：293/42 | 提交时间：2021/03/30
Strain hardening Transformation-induced plasticity Heterogeneous structures Precipitates Twins |
| Strain rate dependent shear localization and deformation mechanisms in the CrMnFeCoNi high-entropy alloy with various microstructures 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 793, 页码: 10
作者: Yang ZL(杨正凌); Yang MX(杨沐鑫); Ma Y(马彦); Zhou LL(周玲玲); Cheng WQ(程文强); Yuan FP(袁福平); Wu XL(武晓雷)
Adobe PDF(13197Kb) | 收藏 | 浏览/下载：335/117 | 提交时间：2020/11/30
High entropy alloys Deformation twins Shear localization Strain rate effect Strain hardening |
| Abnormal softening of Ti-metallic glasses during nanosecond laser shock peening 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 773, 页码: 6
作者: Li YS(李炎森); Zhang K(张坤); Wang Y(王洋); Tang WQ(唐伟奇); Zhang YT(张亚婷); Wei BC(魏炳忱); Hu Z(胡铮)
 浏览 | Adobe PDF(1751Kb) | 收藏 | 浏览/下载：425/86 | 提交时间：2020/04/07
Laser shock wave Metallic glass Grid nanoindentation |
| Mechanism of crack initiation and early growth of high strength steels in very high cycle fatigue regime 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 771, 页码: 9
作者: Song QY(宋清源); Sun CQ(孙成奇)
Adobe PDF(3170Kb) | 收藏 | 浏览/下载：443/82 | 提交时间：2020/03/11
very high cycle fatigue High strength steels Crack initiation mechanism crack growth rate Grain refinement |
| Characteristic of interior crack initiation and early growth for high cycle and very high cycle fatigue of a martensitic stainless steel 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 758, 页码: 112-120
作者: 孙成奇i; Song QY(宋庆元); Zhou LL(周玲玲); Pan XN(潘向南)
浏览 | Adobe PDF(5866Kb) | 收藏 | 浏览/下载：345/93 | 提交时间：2019/09/09
Very high cycle fatigue Crack initiation Crack growth rate Grain refinement Multi-site crack initiation |
| Superior mechanical properties and deformation mechanisms of heterogeneous laminates under dynamic shear loading 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 756, 页码: 492-501
作者: He JY(何金燕); Yuan FP(袁福平); Yang MX(杨沐鑫); Jiao SH(焦四海); Wu XL(武晓雷)
浏览 | Adobe PDF(1558Kb) | 收藏 | 浏览/下载：385/89 | 提交时间：2019/09/09
Laminates Twinning Strain gradient Geometrically necessary dislocations Dynamic fracture Shear band |
| Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者: Song M; Wei ZQ(魏志全); Wang BY; Chen L; Chen L; Szpunar JA
浏览 | Adobe PDF(5717Kb) | 收藏 | 浏览/下载：321/182 | 提交时间：2019/11/27
Through-silicon via Cu protrusion Annealing temperature Electron backscatter diffraction Finite element analysis |
