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Numerical study of vapor condensation and droplet migration on the asymmetrical micropillar arrays 期刊论文
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2024, 卷号: 152, 页码: 12
作者:  Wang, Xin;  Guo, Shuai;  Tang, Zhiwen;  Xu, Bo;  Zhu ZQ(朱志强);  Chen, Zhenqian
收藏  |  浏览/下载：18/0  |  提交时间：2024/04/15
Condensation  Droplet migration  Heat transfer  Asymmetrical structures  Lattice Boltzmann method  
Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2022, 卷号: 34, 期号: 3, 页码: 15
作者:  Chen, Hongqiang;  Xu, Pengzhuo;  Du WF(杜王芳);  Zhang, Yonghai;  Zhu ZQ(朱志强);  Wei, Jinjia
Adobe PDF(2750Kb)  |  收藏  |  浏览/下载：148/34  |  提交时间：2022/07/18
Pool boiling  Heat transfer enhancement  Mini-pin-fins  Critical heat flux  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：311/179  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis