IMECH-IR
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Complex fractures propagations of infill well based on reservoir stress evolution after long-time shale gas production 会议论文
53rd U.S. Rock Mechanics/Geomechanics Symposium, Brooklyn, NY, United states, June 23, 2019 - June 26, 2019
作者:  Zhu HY;  Tang XH;  Liu QY;  Song YJ;  Zhao YP(赵亚溥);  Li KD;  Xiao JL;  McLennan JD
收藏  |  浏览/下载:102/0  |  提交时间:2020/11/20
THERMOELASTIC BENDING AND BUCKLING BEHAVIORS OF NANOBEAMS 会议论文
10th International Congress on Thermal Stresses, 中国南京/Nanjing, China, 2013-05-31
作者:  Wang ZQ(王志乔);  Li JG(李建国);  Zhao YP(赵亚溥);  Li S(李思)
浏览  |  Adobe PDF(116Kb)  |  收藏  |  浏览/下载:388/125  |  提交时间:2014/04/02
Nanobeams  Thermoelastic  Bending  Buckling  
The effects of residual surface stress on the elastic fields of half-plane problems 会议论文
23rd International Congress of Theoretical and Applied Mechanics, 中国北京/Beijing, China, 2012-08-19
作者:  Dong JZ;  Wang ZQ(王之乔);  Lü JG;  Zhao YP(赵亚溥)
浏览  |  Adobe PDF(174Kb)  |  收藏  |  浏览/下载:342/66  |  提交时间:2014/04/02
Residual  Effects  Stress  Plane  Elastic  Surface  Shear  Concentrated  Short  Figuration  Terms  Loading  Solutions  Integral  Little  Relations  General  Behaviour  Fourier  Without  
Major factors of protein evolution revealed by eigenvalue decomposition analysis 会议论文
2008 International Conference on Bioinformatics and Computational Biology, BIOCOMP 2008, Las Vegas, NV, United states, July 14, 2008 - July 17, 2008
作者:  Liu X(刘鑫);  Zhang LM;  Yin J;  Zhao YP(赵亚溥)
浏览  |  Adobe PDF(1129Kb)  |  收藏  |  浏览/下载:103/18  |  提交时间:2017/06/01
Eigenvalue Decomposition Analysis  Hydrophobic Interaction  Protein Evolution  Remote Homologues  Sequence Analysis And Alignment  
Piezoelectricity of ZnO films prepared by sol-gel method 会议论文
6th China International Conference on Nanoscience and Technology, Chengdu, PEOPLES R CHINA, 2007
作者:  Zhang KM;  Zhao YP(赵亚溥);  He FQ(何发泉);  Liu DQ;  Zhao YP
Adobe PDF(1733Kb)  |  收藏  |  浏览/下载:679/164  |  提交时间:2009/07/23
Zno Thin Films  Piezoelectric Coefficient  Piezo-response Force Microscope  Sol-gel  Surface Roughness  Resistivity  
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
作者:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
Adobe PDF(691Kb)  |  收藏  |  浏览/下载:345/85  |  提交时间:2014/02/14
Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation