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| 液气界面张力垂直分量在固着液滴蒸发中的作用 会议论文
中国力学大会-2015, 中国上海, 2015-08-16
作者: 余迎松 ; 王子千; 赵亚溥
 浏览 |  Adobe PDF(229Kb) |  收藏 | 浏览/下载：373/68 | 提交时间：2016/08/16
垂直分量 界面张力 液滴蒸发 弯曲问题 质量配比 变换方法 聚二甲基硅氧烷 表面变形 圆板 理论分析 |
| A density functional study of zinc oxide elastic properties under high pressure 会议论文
IUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures, Beijing, China, AUG 8-12, 2010
作者: Wang BB(王斌斌); Zhao YP(赵亚溥)
 Adobe PDF(872Kb) | 收藏 | 浏览/下载：677/246 | 提交时间：2014/03/04
Zno Elastic Properties Density Functional Theory (Dft) Multi-scale Simulation |
| 移动接触线诱导蛋白质薄膜屈曲与断裂的实时在位观测 会议论文
中国力学大会——2013, 中国北京, 2013-08-19
作者: 赵亚溥; 王子千
Adobe PDF(384Kb) | 收藏 | 浏览/下载：496/116 | 提交时间：2014/04/02
蛋白质薄膜 在位观测 移动接触线 断裂的 实时 动态力学行为 表征 扫描显微镜 细节信息 动态传播:断裂过程:实验研究:裂纹:首次通过:褶皱:诱导的:液滴:转变过程:进一步:0 |
| A density functional study of zinc oxide elastic properties under high pressure 会议论文
IUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures, 2010, Beijing, China, August 8, 2010 - August 12, 2010
作者: Wang BB; Zhao YP(赵亚溥)
Adobe PDF(872Kb) | 收藏 | 浏览/下载：232/101 | 提交时间：2018/11/08
Biosensors Blending Chemical vapor deposition Crystal symmetry Crystals Density functional theory Elastic constants Elasticity II VI semiconductors Lattice constants Local density approximation Nanocomposites Nanostructured materials Zinc sulfide Chemical vapor depositions (CVD) Density functional study Elastic properties Environment pressure Generalized gradient approximations Longitudinal direction Multi scale simulation Zinc blend structure |
| Electro-elasto-capillarity:electric field driven unwrapping of water drop with elastic film 会议论文
23rd International Congress of Theoretical and Applied Mechanics, 中国北京/Beijing, China, 2012-08-19
作者: Zhao YP(赵亚溥); Wang ZQ(王志乔); Wang FC(王奉超)
浏览 | Adobe PDF(164Kb) | 收藏 | 浏览/下载：378/92 | 提交时间：2014/04/02
Capillarity Driven Unwrapping Water Field Electric Elasto Elastic Moving Substrate Progress Agreement Tension Doubling Release Finding Voltage Established Force Describe |
| The influences of residual surface stress on the thermo-elastic bending of simply supported nanoplates 会议论文
3rd International Conference on Heterogeneous Materials Mechanics, ICHMM 2011, Shanghai, China, MAY 22-26, 2011
作者: Wang ZQ(王志乔); Zhao YP(赵亚溥); Wang ZQ
浏览 | Adobe PDF(141Kb) | 收藏 | 浏览/下载：624/124 | 提交时间：2013/02/26
Elasticity Interfacial Energy Surface Properties Classical Plate Theory Mechanical Behavior Nano Scale Nanoplates Simply Supported Surface Elasticities Surface Residual Stress Surface Stress Thermal Bending |
| EXPERIMENTAL AND THEORETICAL STUDY OF BINARY DROPLET HEAD-ON COLLISIONS IN MEMS 会议论文
9th Biennial Conference on Engineering Systems Design and Analysis, Haifa, ISRAEL, JUL 07-09, 2008
作者: Zhao YP(赵亚溥); Wang FC(王奉超); Feng JT(冯江涛); Zhao YP
浏览 | Adobe PDF(241Kb) | 收藏 | 浏览/下载：756/96 | 提交时间：2009/07/23
Droplet Collision Rebound Coalescence Conglutination Contact Time Hertz Contact Theory Pdms |
| Electrowetting on a lotus leaf 会议论文
Conference on Advances in Microfluidics and Nanofluidics, Hong Kong Univ Sci & Technol, Hong Kong, PEOPLES R CHINA, 2009
作者: Feng JT(冯江涛); Wang FC(王奉超); Zhao YP(赵亚溥); Zhao YP
Adobe PDF(682Kb) | 收藏 | 浏览/下载：797/165 | 提交时间：2009/07/23
Biomems Chemical Analysis Drops Hydrophobicity Lab-on-a-chip Microactuators Microfluidics Wetting Thin-films Actuation Displays Droplets Surfaces Fields |
| Influence of particle-size distribution on effective properties of nanocomposites 会议论文
Advances in Heterogeneous Material Mechanics 2008 - 2nd International Conference on Heterogeneous Material Mechanics, ICHMM 2008, Huangshan, China, June 3, 2008 - June 8, 2008
作者: Huang ZP; Wang ZQ; Zhao YP(赵亚溥); Wang J
收藏 | 浏览/下载：200/0 | 提交时间：2017/06/01
Closed-form Solutions Constitutive Relations Effective Properties Energy Effects Filled Composites First Kind Piola-kirchhoff Interface Stress Interface Energies Interface Energy Effect Interface Stresses Kirchhoff Lagrangian Description Of The Young-laplace Equations Lagrangian Descriptions Nanometer Ranges Particle-size Distribution Shear Modulus Size Dependences Size Dispersions |
| Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
作者: Wang HY(汪海英); Wang JJ(王建军); Liu S; Zhao YP(赵亚溥)
Adobe PDF(691Kb) | 收藏 | 浏览/下载：336/82 | 提交时间：2014/02/14
Solder Underfill Filled 0 Outmost Substrate 0 Fatigue Package Understand Joints Thermal Lives 0 Silicon Reliability Range 0 Different Smaller Corners Studied Assumed Simulation |
