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Complex fractures propagations of infill well based on reservoir stress evolution after long-time shale gas production 会议论文
53rd U.S. Rock Mechanics/Geomechanics Symposium, Brooklyn, NY, United states, June 23, 2019 - June 26, 2019
作者:  Zhu HY;  Tang XH;  Liu QY;  Song YJ;  Zhao YP(赵亚溥);  Li KD;  Xiao JL;  McLennan JD
收藏  |  浏览/下载：94/0  |  提交时间：2020/11/20
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
作者:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
Adobe PDF(691Kb)  |  收藏  |  浏览/下载：336/82  |  提交时间：2014/02/14
Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation