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Effect of tool size on the cutting of aluminum film with micrometer-level thickness 期刊论文
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2022, 卷号: 241, 页码: 13
作者:  Ye X(叶璇);  Wang T;  Liu XM(刘小明);  Wei YG(魏悦广)
Adobe PDF(7971Kb)  |  收藏  |  浏览/下载：174/39  |  提交时间：2022/05/17
Ductile film  Cutting force model  Branched concertina tear  Curling flap  Critical tool size  
Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate 期刊论文
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2018, 卷号: 85, 期号: 9, 页码: Ar-91004
作者:  Yin HB;  Chen SH;  Liang LH(梁立红);  Peng ZL(彭志龙);  Wei YG(魏悦广)
浏览  |  Adobe PDF(4041Kb)  |  收藏  |  浏览/下载：346/138  |  提交时间：2018/12/12
film-substrate system  interface behavior  peeling force  cohesive zone model  L-J potential  
Multiple-scale interface fracture analysis for thin film/substrate system under temperature mismatch 会议论文
IUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures, Beijing, China, AUG 08-12, 2010
作者:  Li MZ(李美之);  Ma HS(马寒松);  Liang LH(梁立红);  Wei YG(魏悦广);  Li MZ(李美之)
浏览  |  Adobe PDF(333Kb)  |  收藏  |  浏览/下载：621/189  |  提交时间：2014/03/04
Multiple-scale Fracture  Thin Film  Temperature Mismatch  Fracture Energy  Discrete Dislocation  
Nanoscale friction behavior of the Ni-film/substrate system under scratching using MD simulation 期刊论文
TRIBOLOGY LETTERS, 2012, 卷号: 46, 期号: 2, 页码: 167-178
作者:  Liu XM(刘小明);  Liu ZL;  Wei YG(魏悦广);  Liu, XM;  Chinese Acad Sci, Inst Mech, LNM, Beijing 100190, Peoples R China.
Adobe PDF(1710Kb)  |  收藏  |  浏览/下载：907/311  |  提交时间：2013/01/18
Nanotribology  Friction  Reducing  Friction Mechanisms  Films  Dynamic Modeling  Molecular-dynamics Simulation  Randomly Rough Surfaces  Dislocation Nucleation  Atomistic Simulation  Contact Mechanics  Film Thickness  Thin-films  Nanoindentation  Deformation  Multilayers  
Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models 期刊论文
International Journal of Solids and Structures, 2008, 页码: 3779-3792
作者:  Wei YG(魏悦广);  Zhao HF(赵海峰);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Adobe PDF(867Kb)  |  收藏  |  浏览/下载：705/163  |  提交时间：2009/08/03
Peel Experiment  Metal Thin Film  Analytical Model  Interfacial Fracture Energy  Pressure-sensitive Adhesive  Strain Gradient Plasticity  State Crack-growth  Fracture Criterion  Cantilever Beam  Round-robin  Work  Toughness  Strength  Surface  
Inverse Analysis Determining Interfacial Properties Between Metal Film And Ceramic Substrate With An Adhesive Layer 期刊论文
Acta Mechanica Sinica, 2008, 卷号: 24, 期号: 3, 页码: 297-303
作者:  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech LNM, Beijing 100080, Peoples R China.
Adobe PDF(648Kb)  |  收藏  |  浏览/下载：671/211  |  提交时间：2009/08/03
Thin Film  Peel Test  Interface Toughness  Cohesive Zonemodel  Inverse Analysis  Peel Test  Cu/cr/polyimide System  Fracture Energy  Thin-films  Strength  Joints  Simulations  Plasticity  Surface  Model  
Determination Ofinterfacial Mechanical Parameters For An Al/Epoxy/Al2O3 System Byusing Peel Test Simulations 期刊论文
Acta Mechanica Solida Sinica, 2008, 页码: 198-206
作者:  You XM(尤雪梅);  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(345Kb)  |  收藏  |  浏览/下载：652/138  |  提交时间：2009/08/03
Peel Test  Interface Toughness  Cohesive Zone Model  Energy Release Rate  Ductile Thin-films  Cu/cr/polyimide System  Adhesive Joints  Fracture Energy  Ceramic Substrate  Metal-film  Strength  Layer  Plasticity  Surface  
Determination of interface properties between micron-thick metal film and ceramic substrate using peel test 期刊论文
International Journal of Fracture, 2007, 卷号: 144, 期号: 2, 页码: 103-112
作者:  Zhao HF(赵海峰);  Wei YG(魏悦广);  Zhao, HF (reprint author), Chinese Acad Sci, State Key Lab Nonlinear Mech LNM, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(591Kb)  |  收藏  |  浏览/下载：613/173  |  提交时间：2009/08/03
Interfacial Toughness  Metal Thin Film  Peel Test  Cohesive Zone Model  Inverse Analysis  Strain Gradient Plasticity  State Crack-growth  Cu/cr/polyimide System  Adhesive Joints  Fracture Energy  Strength  Layer  Work  Simulations  Surface  
Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
作者:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
浏览  |  Adobe PDF(165Kb)  |  收藏  |  浏览/下载：102/21  |  提交时间：2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination