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A diffusion and curvature dependent surface elastic model with application to stress analysis of anode in lithium ion battery 期刊论文
INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE, 2012, 卷号: 61, 页码: 156-170
作者:  Zang JL(臧金良);  Zhao YP(赵亚溥);  Zhao, YP;  Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(1292Kb)  |  收藏  |  浏览/下载：1206/311  |  提交时间：2013/01/18
Surface Elastic Model  Tolman Length  Lithium Ion Battery  Nanostructured Si Electrode  Pulverization  Molecular-dynamics  Linear-theory  Silicon  Electrodes  Account  Solids  Energy  Shells  
Negative differential resistance behavior of silicon monatomic chain encapsulated in carbon nanotubes 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2012, 卷号: 62, 页码: 87-92
作者:  Zhang YY(张营营);  Wang FC(王奉超);  Zhao YP(赵亚溥);  Zhao, YP;  Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(1095Kb)  |  收藏  |  浏览/下载：951/287  |  提交时间：2013/01/18
Silicon Monatomic Chain  Size-selective Encapsulation  Electronic Transport Properties  Negative Differential Resistance  Transmission Spectrum  Field-effect Transistors  Single  Nanowires  Simulations  
Adhesive Contact of Nanowire in Three-Point Bending Test 期刊论文
Journal of Adhesion Science and Technology, 2011, 卷号: 25, 期号: 10, 页码: 1107-1129
作者:  Zhang Y(张吟);  Zhao YP(赵亚溥);  Zhao, YP (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
Adobe PDF(365Kb)  |  收藏  |  浏览/下载：1176/582  |  提交时间：2012/04/01
Adhesion  Nanowire  Young's Modulus  Receding Contact  Lift-off  Boundary Conditions  Elastic Half-space  Atomic-force Microscopy  Carbon Nanotube Ropes  Unbonded Contact  Silicon-nitride  Surface Stress  Modulus  Single  Beam  Cantilever  
Growth of liquid bridge in AFM 期刊论文
Journal of Physics D-Applied Physics, 2007, 卷号: 40, 期号: 14, 页码: 4368-4375
作者:  Wei Z(魏征);  Zhao YP(赵亚溥);  Zhao, YP (reprint author), Chinese Acad Sci, State Key Lab Nonlinear Mech, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(231Kb)  |  收藏  |  浏览/下载：610/160  |  提交时间：2009/08/03
Atomic-force Microscope  Capillary Condensation  Adhesion Forces  Water  Adsorption  Silicon  Mica  Pressure  Surfaces  Films  
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
作者:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
Adobe PDF(691Kb)  |  收藏  |  浏览/下载：337/82  |  提交时间：2014/02/14
Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation