|
Selected(0)Clear
Items/Page: Sort: |
| THERMOELASTIC BENDING AND BUCKLING BEHAVIORS OF NANOBEAMS 会议论文
10th International Congress on Thermal Stresses, 中国南京/Nanjing, China, 2013-05-31
Authors: Wang ZQ(王志乔); Li JG(李建国) ; Zhao YP(赵亚溥); Li S(李思)
 View |  Adobe PDF(116Kb) |  Favorite | View/Download：396/127 | Submit date：2014/04/02
Nanobeams Thermoelastic Bending Buckling |
| The effects of residual surface stress on the elastic fields of half-plane problems 会议论文
23rd International Congress of Theoretical and Applied Mechanics, 中国北京/Beijing, China, 2012-08-19
Authors: Dong JZ; Wang ZQ(王之乔); Lü JG; Zhao YP(赵亚溥)
View | Adobe PDF(174Kb) | Favorite | View/Download：356/70 | Submit date：2014/04/02
Residual Effects Stress Plane Elastic Surface Shear Concentrated Short Figuration Terms Loading Solutions Integral Little Relations General Behaviour Fourier Without |
| Transport properties and induced voltage in the structure of water-filled single-walled boron-nitrogen nanotubes 会议论文
Conference on Advances in Microfluidics and Nanofluidics, Hong Kong Univ Sci & Technol, Hong Kong, PEOPLES R CHINA, 2009
Authors: Yuan QZ; Zhao YP(赵亚溥); Zhao YP
Adobe PDF(352Kb) | Favorite | View/Download：798/143 | Submit date：2009/07/23
Boron Compounds Density Functional Theory Diffusion Iii-v Semiconductors Molecular Dynamics Method Nanofluidics Pipe Flow Semiconductor Nanotubes Wide Band Gap Semiconductors Carbon Nanotubes Molecular-dynamics Nitride Nanotubes Channel Flow Liquids |
| Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film 会议论文
14th International Conference on the Strength of Materials (ICSMA 14), Xian Jiaotong Univ, Xian, PEOPLES R CHINA, JUN 04-09, 2006
Authors: Hu YQ(胡宇群); Zhao YP(赵亚溥); Yu TX(余同希); Zhao YP
Adobe PDF(867Kb) | Favorite | View/Download：735/200 | Submit date：2009/07/23
Anodic Bonding Dendritic Nanostructures Aluminum Thin Film Depletion Layer Mems Ion Drift Processes Borosilicate Glass Depletion |
| Molecular Dynamics Simulation of Barnacle Cement 会议论文
Symposium on Micomechanics of Advanced Materials held in Honour of James C M Lis 80th Birthday held at the TMS 2004 Annual Meeting, NOV, 2004 San Francisco, CA
Authors: Yin J(尹俊); Zhao YP(赵亚溥); Zhu RC(朱如曾)
Adobe PDF(543Kb) | Favorite | View/Download：580/153 | Submit date：2007/12/18 |
| Hysteresis effect in adhesive elastic contact 会议论文
2003 ASME Design Engineering Technical Conferences and Computers and Information in Engineering Conference, Chicago, IL, United states, September 2, 2003 - September 6, 2003
Authors: Wei Z(魏征); Zhao YP(赵亚溥)
 Adobe PDF(349Kb) | Favorite | View/Download：135/50 | Submit date：2017/06/01
Scanning Probe Microscope (Spm) Transition Parameter |
| Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors: Wang HY(汪海英); Wang JJ(王建军); Liu S; Zhao YP(赵亚溥)
Adobe PDF(691Kb) | Favorite | View/Download：357/86 | Submit date：2014/02/14
Solder Underfill Filled 0 Outmost Substrate 0 Fatigue Package Understand Joints Thermal Lives 0 Silicon Reliability Range 0 Different Smaller Corners Studied Assumed Simulation |
