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A regime beyond the Hall-Petch and inverse-Hall-Petch regimes in ultrafine-grained solids 期刊论文
COMMUNICATIONS PHYSICS, 2022, 卷号: 5, 期号: 1, 页码: 9
Authors:  Zhang, Huijun;  Liu, Feng;  Ungar, Goran;  Zheng ZY(郑中玉);  Sun, Qingping;  Han, Yilong
Adobe PDF(3619Kb)  |  Favorite  |  View/Download：189/36  |  Submit date：2023/02/20
Numerical study of turbulent flow past a rotating axial-flow pump based on a level-set immersed boundary method 期刊论文
RENEWABLE ENERGY, 2021, 卷号: 168, 页码: 960-971
Authors:  Kan, Kan;  Yang ZX(杨子轩);  Lyu, Pin;  Zheng, Yuan;  Shen, Lian
Adobe PDF(2360Kb)  |  Favorite  |  View/Download：394/176  |  Submit date：2021/03/30
Axial-flow pump  Large-eddy simulation  Immersed boundary method  Level set function  Turbulent kinetic energy  Flow separation  
Study of shock train/flame interaction and skin-friction reduction by hydrogen combustion in compressible boundary layer 期刊论文
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2020, 卷号: 45, 期号: 31, 页码: 15683-15696
Authors:  Xue R(薛瑞);  Zheng X;  Yue LJ(岳连捷);  Zhang SK;  Weng C
Adobe PDF(3251Kb)  |  Favorite  |  View/Download：376/115  |  Submit date：2020/07/06
Compressible boundary layer combustion  Skin-friction reduction  Shock train/flame interaction  
Efficient strategy for reliability-based optimization design of multidisciplinary coupled system with interval parameters 期刊论文
APPLIED MATHEMATICAL MODELLING, 2019, 卷号: 75, 页码: 349-370
Authors:  Wang RX(王睿星);  Luo Y
View  |  Adobe PDF(4483Kb)  |  Favorite  |  View/Download：254/92  |  Submit date：2019/11/25
Multidisciplinary design optimization  Non-probabilistic reliability  Uncertainty propagation analysis  Gradient information  Interval reliability displacement  
Compression Generated by a 3D Supracellular Actomyosin Cortex Promotes Embryonic Stem Cell Colony Growth and Expression of Nanog and Oct4 期刊论文
CELL SYSTEMS, 2019, 卷号: 9, 期号: 2, 页码: 214-+
Authors:  Du J;  Fan YL;  Guo Z;  Wang YG;  Zheng X(郑旭);  Huang C;  Liang BH;  Gao LY;  Cao YP;  Chen YP;  Zhang X;  Li L;  Xu LP;  Wu CY;  Weitz DA;  Feng XQ
View  |  Adobe PDF(2430Kb)  |  Favorite  |  View/Download：448/230  |  Submit date：2019/10/21
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：335/185  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis