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| Physical mechanics investigation into carbon utilization and storage with enhancing shale oil and gas recovery 期刊论文 SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2022, 卷号: 65, 期号: 2, 页码: 490-492 Authors: Zhao YP(赵亚溥)![](/image/person.jpg)
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| Mortar dynamic coupled model for calculating interface gas exchange between organic and inorganic matters of shale 期刊论文 ENERGY, 2021, 卷号: 236, 页码: 16 Authors: Cao GH(曹高辉) ; Jiang WB(江文滨) ; Lin M(林缅) ; Ji LL(姬莉莉) ; Xu ZP(徐志朋) ; Zheng SP(郑思平); Hao, Fang
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| Opposed flame spread over thick solid fuels under influence of sub-atmospheric pressure and low-velocity flow 期刊论文 FIRE SAFETY JOURNAL, 2021, 卷号: 125, 页码: 8 Authors: Zhu F(朱凤) ; Wang SF(王双峰) ; Lu, Zhanbin; Wu CJ(吴传嘉)![](/image/person.jpg)
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| Reynolds number effect on statistics of turbulent flows over periodic hills 期刊论文 PHYSICS OF FLUIDS, 2021, 卷号: 33, 期号: 10, 页码: 28 Authors: Zhou ZD(周志登) ; Wu T(吴霆); Yang XL(杨晓雷)![](/image/person.jpg)
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| Atomistic modeling for the extremely low and high temperature-dependent yield strength in a Ni-based single crystal superalloy 期刊论文 MATERIALS TODAY COMMUNICATIONS, 2021, 卷号: 27, 页码: 6 Authors: Zhang ZW(张志伟) ; Fu, Qiang ; Wang J(王军) ; Yang R(杨荣) ; Xiao P(肖攀) ; Ke FJ(柯孚久) ; Lu CS(卢春生)![](/image/person.jpg)
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| Dynamic behaviors of a laser-induced bubble and transition mechanism of collapse patterns in a tube 期刊论文 AIP ADVANCES, 2020, 卷号: 10, 期号: 3, 页码: 11 Authors: Li HC(李泓辰) ; Huang J(黄荐); Wu XQ(吴先前) ; Zhang J(张健); Wang JZ(王静竹); Wang YW(王一伟) ; Huang CG(黄晨光)![](/image/person.jpg)
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| Numerical study of convective heat transfer of a supersonic combustor with varied inlet flow conditions 期刊论文 ACTA MECHANICA SINICA, 2019, 卷号: 35, 期号: 5, 页码: 943-953 Authors: Fan WH(范文慧); Zhong FQ(仲峰泉) ; Ma SG(马素刚); Zhang XY(张新宇)![](/image/person.jpg)
View  |   Adobe PDF(4075Kb)  |   Favorite  |  View/Download:325/98  |  Submit date:2020/03/11 Wall heat flux Numerical simulation Ethylene Supersonic combustor |
| Estimating lift from wake velocity data in flapping flight 期刊论文 JOURNAL OF FLUID MECHANICS, 2019, 卷号: 868, 页码: 501-537 Authors: Wang SZ(王士召) ; He GW(何国威) ; Liu TS(刘天舒)
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| Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74 Authors: Song M; Wei ZQ(魏志全); Wang BY; Chen L; Chen L; Szpunar JA
View  |   Adobe PDF(5717Kb)  |   Favorite  |  View/Download:335/185  |  Submit date:2019/11/27 Through-silicon via Cu protrusion Annealing temperature Electron backscatter diffraction Finite element analysis |