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Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer 期刊论文
Acta Metallurgica Sinica(English Letters), 2004, 卷号: 17, 期号: 3, 页码: 247-254
Authors:  Zhou Y;  Yang CS;  Chen JA;  Ding GF;  Wang L;  Wang MJ;  Zhang YM;  Zhang TH(张泰华)
View  |  Adobe PDF(475Kb)  |  Favorite  |  View/Download:183/46  |  Submit date:2015/09/14
Nickel Film Microbridge  Mems  Mechanical Property  Loadeflection Measurement