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Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package 期刊论文
COMPOSITE STRUCTURES, 1997, 卷号: 38, 期号: 1-4, 页码: 525-530
Authors:  Wu CML;  Lai JKL;  Wu YL(吴永礼);  Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong.
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