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新型可控坍塌芯片连接技术(C4)及芯下材料力学性能研究进展 期刊论文
机械强度, 2002, 卷号: 24, 期号: 3, 页码: 315-319
Authors:  汪海英;  白以龙;  赵亚溥;  刘胜
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微电子封装  可控坍塌芯片连接技术  芯下材料  力学性能  可靠性  
Closed Trans-Scale Statistical Microdamage Mechanics 期刊论文
Acta Mechanica Sinica, 2002, 卷号: 18, 期号: 1, 页码: 1-17
Authors:  Bai YL(白以龙);  Xia MF(夏蒙棼);  Ke FJ(柯孚久);  Li HL(李晖凌);  Bai, YL (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
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Combined Effects of Silica Filler and Its Interface in Epoxy Resin 期刊论文
Acta Materialia, 2002, 卷号: 50, 期号: 17, 页码: 4369-4377
Authors:  Wang HY(汪海英);  Bai YL(白以龙);  Liu S(刘胜);  Wu JL;  Wong CP;  Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Adobe PDF(459Kb)  |  Favorite  |  View/Download：1099/408  |  Submit date：2007/06/15