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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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Funding Organization:Fundamental Research Funds for the Central Universities
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Correlating dynamic relaxation and viscoelasticity in metallic glasses
期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2024, 卷号: 67, 期号: 5, 页码: 10
Authors:
Xing, GuangHui
;
Hao, Qi
;
Zhu, Fan
;
Wang YJ(王云江)
;
Yang, Yong
;
Kato, Hidemi
;
Pineda, Eloi
;
Lan, Si
;
Qiao, JiChao
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View/Download:6/0
  |  
Submit date:2024/05/27
metallic glasses
dynamics relaxation
two-step relaxation
stress relaxation
creep
A regime beyond the Hall-Petch and inverse-Hall-Petch regimes in ultrafine-grained solids
期刊论文
COMMUNICATIONS PHYSICS, 2022, 卷号: 5, 期号: 1, 页码: 9
Authors:
Zhang, Huijun
;
Liu, Feng
;
Ungar, Goran
;
Zheng ZY(郑中玉)
;
Sun, Qingping
;
Han, Yilong
Adobe PDF(3619Kb)
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View/Download:184/35
  |  
Submit date:2023/02/20
A novel method for fabricating micro-dimple arrays with good surface quality on metallic glass substrate by combining laser irradiation and mechanical polishing under wax sealing
期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2022, 卷号: 79, 页码: 911-923
Authors:
Huang, Hu
;
Qian, Yongfeng
;
Zhang, Lin
;
Jiang MQ(蒋敏强)
;
Yan, Jiwang
Adobe PDF(9801Kb)
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View/Download:156/40
  |  
Submit date:2022/08/10
Metallic glass
Laser irradiation
Mechanical polishing
micro-dimple array
Surface quality
micro
nano-manufacturing
Ideal superelasticity in Ni-based Heusler alloys
期刊论文
ACTA MATERIALIA, 2021, 卷号: 210, 页码: 11
Authors:
Cao PY(曹沛宇)
;
Tian, Fuyang
;
Li, Wei
;
Vitos, Levente
;
Wang, Yandong
Adobe PDF(4366Kb)
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View/Download:340/93
  |  
Submit date:2021/06/15
Heusler alloys
shape memory alloys
martensitic phase transformation
nonhysteretic superelasticity
first-principles calculation
Reinforcement effect of polypropylene fiber on dynamic properties of cemented tailings backfill under SHPB impact loading
期刊论文
CONSTRUCTION AND BUILDING MATERIALS, 2021, 卷号: 279, 页码: 11
Authors:
Xue Gaili
;
Yilmaz Erol
;
Feng Guorui
;
Cao Shuai
;
Sun LJ(孙立娟)
Adobe PDF(3413Kb)
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View/Download:338/71
  |  
Submit date:2021/05/17
Cemented tailings backfill
Fiber reinforcement
Waveform properties
Dynamic strength
Failure mode
Study of shock train/flame interaction and skin-friction reduction by hydrogen combustion in compressible boundary layer
期刊论文
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2020, 卷号: 45, 期号: 31, 页码: 15683-15696
Authors:
Xue R(薛瑞)
;
Zheng X
;
Yue LJ(岳连捷)
;
Zhang SK
;
Weng C
Adobe PDF(3251Kb)
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View/Download:365/113
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Submit date:2020/07/06
Compressible boundary layer combustion
Skin-friction reduction
Shock train/flame interaction
Efficient strategy for reliability-based optimization design of multidisciplinary coupled system with interval parameters
期刊论文
APPLIED MATHEMATICAL MODELLING, 2019, 卷号: 75, 页码: 349-370
Authors:
Wang RX(王睿星)
;
Luo Y
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Adobe PDF(4483Kb)
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View/Download:246/88
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Submit date:2019/11/25
Multidisciplinary design optimization
Non-probabilistic reliability
Uncertainty propagation analysis
Gradient information
Interval reliability displacement
Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation
期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
Authors:
Long X
;
Hu B
;
Feng YH(冯义辉)
;
Chang C
;
Li MY
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  |  
Adobe PDF(3448Kb)
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View/Download:331/168
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Submit date:2020/03/11
Silver nanoparticles
Silver microparticles
Nanoindentation
Microstructure
Constitutive behaviour
Compression Generated by a 3D Supracellular Actomyosin Cortex Promotes Embryonic Stem Cell Colony Growth and Expression of Nanog and Oct4
期刊论文
CELL SYSTEMS, 2019, 卷号: 9, 期号: 2, 页码: 214-+
Authors:
Du J
;
Fan YL
;
Guo Z
;
Wang YG
;
Zheng X(郑旭)
;
Huang C
;
Liang BH
;
Gao LY
;
Cao YP
;
Chen YP
;
Zhang X
;
Li L
;
Xu LP
;
Wu CY
;
Weitz DA
;
Feng XQ
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  |  
Adobe PDF(2430Kb)
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View/Download:438/226
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Submit date:2019/10/21
Study on copper protrusion of through-silicon via in a 3-D integrated circuit
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:
Song M
;
Wei ZQ(魏志全)
;
Wang BY
;
Chen L
;
Chen L
;
Szpunar JA
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  |  
Adobe PDF(5717Kb)
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View/Download:327/183
  |  
Submit date:2019/11/27
Through-silicon via
Cu protrusion
Annealing temperature
Electron backscatter diffraction
Finite element analysis