Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages

IMECH-IR > 力学所知识产出(1956-2008)

	Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages
	Wang HY(汪海英); Wang JJ(王建军); Liu S; Zhao YP(赵亚溥)
会议录名称	Proceedings of the Fourth International Symposium on Electronic Packaging Technology
	2001
页码	394-398
会议名称	Fourth International Symposium on Electronic Packaging Technology
会议日期	2001-8-8
会议地点	北京/Beijing, China
摘要	A finite element framework is established with the consideration of complete and different incomplete filled flip-chip package models.A nonlinear finite element technique,in which the viscoplastic material properties(strain rate dependent) of solder balls and underfill are considered,is adapted t...
关键词	Solder Underfill Filled 0 Outmost Substrate 0 Fatigue Package Understand Joints Thermal Lives 0 Silicon Reliability Range 0 Different Smaller Corners Studied Assumed Simulation
课题组名称	LNM;Institute of Mechanics;Chinese Academy of Sciences;Department of Mechanical Engineering;Wayne State University;Detroit;MI48202;USA;
语种	英语
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/48194
专题	力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Wang HY,Wang JJ,Liu S,et al. Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages[C]Proceedings of the Fourth International Symposium on Electronic Packaging Technology,2001:394-398.