IMECH-IR  > 力学所知识产出(1956-2008)
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages
Wang HY(汪海英); Wang JJ(王建军); Liu S; Zhao YP(赵亚溥)
Source PublicationProceedings of the Fourth International Symposium on Electronic Packaging Technology
2001
Pages394-398
Conference NameFourth International Symposium on Electronic Packaging Technology
Conference Date2001-8-8
Conference Place北京/Beijing, China
AbstractA finite element framework is established with the consideration of complete and different incomplete filled flip-chip package models.A nonlinear finite element technique,in which the viscoplastic material properties(strain rate dependent) of solder balls and underfill are considered,is adapted t...
KeywordSolder Underfill Filled 0 Outmost Substrate 0 Fatigue Package Understand Joints Thermal Lives 0 Silicon Reliability Range 0 Different Smaller Corners Studied Assumed Simulation
DepartmentLNM;Institute of Mechanics;Chinese Academy of Sciences;Department of Mechanical Engineering;Wayne State University;Detroit;MI48202;USA;
Language英语
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/48194
Collection力学所知识产出(1956-2008)
Recommended Citation
GB/T 7714
Wang HY,Wang JJ,Liu S,et al. Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages[C]Proceedings of the Fourth International Symposium on Electronic Packaging Technology,2001:394-398.
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