IMECH-IR  > 力学所知识产出(1956-2008)
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages
Wang HY(汪海英); Wang JJ(王建军); Liu S; Zhao YP(赵亚溥)
Source PublicationProceedings of the Fourth International Symposium on Electronic Packaging Technology
2001
Pages394-398
Conference NameFourth International Symposium on Electronic Packaging Technology
Conference Date2001-8-8
Conference Place北京/Beijing, China
AbstractA finite element framework is established with the consideration of complete and different incomplete filled flip-chip package models.A nonlinear finite element technique,in which the viscoplastic material properties(strain rate dependent) of solder balls and underfill are considered,is adapted t...
KeywordSolder Underfill Filled 0 Outmost Substrate 0 Fatigue Package Understand Joints Thermal Lives 0 Silicon Reliability Range 0 Different Smaller Corners Studied Assumed Simulation
DepartmentLNM;Institute of Mechanics;Chinese Academy of Sciences;Department of Mechanical Engineering;Wayne State University;Detroit;MI48202;USA;
Language英语
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/48194
Collection力学所知识产出(1956-2008)
Recommended Citation
GB/T 7714
Wang HY,Wang JJ,Liu S,et al. Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages[C],2001:394-398.
Files in This Item: Download All
File Name/Size DocType Version Access License
IrCA543.pdf(691KB) 开放获取--View Download
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[汪海英]'s Articles
[王建军]'s Articles
[Liu S]'s Articles
Baidu academic
Similar articles in Baidu academic
[汪海英]'s Articles
[王建军]'s Articles
[Liu S]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[汪海英]'s Articles
[王建军]'s Articles
[Liu S]'s Articles
Terms of Use
No data!
Social Bookmark/Share
File name: IrCA543.pdf
Format: Adobe PDF
This file does not support browsing at this time
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.