IMECH-IR  > 力学所知识产出(1956-2008)
Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package
Wu CML; Lai JKL; Wu YL(吴永礼); Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong.
Source PublicationCOMPOSITE STRUCTURES
1997
Volume38Issue:1-4Pages:525-530
ISSN0263-8223
AbstractA tape automated bonded (TAB) package is basically a composite structure. A three-dimensional finite element fracture analysis was performed to evaluate the effects of cracks in a TAB package under thermal cycling conditions. The lead-tin solder in the outer lead bond as well as the copper beam lead were taken as elasto-plastic materials. Interface cracks between the copper beam lead and the solder were included in the analysis. It was found that the prescribed cracks created new sources of stress concentrations, which are fairly mild. This result showed that the configuration of the outer lead bonds in TAB packages is generally resilient to thermal cycling, even with the presence of defects such as cracks. (C) 1997 Elsevier Science Ltd.
DOI10.1016/S0263-8223(97)00088-3
Indexed BySCI
Language英语
WOS IDWOS:000071253500054
WOS KeywordINTERCONNECTIONS
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Composites
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/58495
Collection力学所知识产出(1956-2008)
Corresponding AuthorWu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong.
Recommended Citation
GB/T 7714
Wu CML,Lai JKL,Wu YL,et al. Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package[J]. COMPOSITE STRUCTURES,1997,38(1-4):525-530.
APA Wu CML,Lai JKL,吴永礼,&Wu, CML .(1997).Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package.COMPOSITE STRUCTURES,38(1-4),525-530.
MLA Wu CML,et al."Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package".COMPOSITE STRUCTURES 38.1-4(1997):525-530.
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