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Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer 期刊论文
Thin Solid Films, 2004, 卷号: 460, 期号: 1, 页码: 175-180
Authors:  Zhou Y;  Yang CS;  Chen JA;  Ding GF,;  Ding W;  Wang L;  Wang MJ;  Zhang YM;  张泰华
Adobe PDF(269Kb)  |  Favorite  |  View/Download：2008/940  |  Submit date：2007/06/15
Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer 期刊论文
Acta Metallurgica Sinica(English Letters), 2004, 卷号: 17, 期号: 3, 页码: 247-254
Authors:  Zhou Y;  Yang CS;  Chen JA;  Ding GF;  Wang L;  Wang MJ;  Zhang YM;  Zhang TH(张泰华)
View  |  Adobe PDF(475Kb)  |  Favorite  |  View/Download：182/46  |  Submit date：2015/09/14
Nickel Film Microbridge  Mems  Mechanical Property  Loadeflection Measurement