中文版 | English

在结果中检索

IMECH-IR

浏览/检索结果: 共7条，第1-7条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Experiments on the mechanical behavior of anodically bonded interlayer of Pyrex Glass/Al/Si 会议论文
13th International Conference on Fracture 2013, ICF 2013, Beijing, China, June 16, 2013 - June 21, 2013
作者:  Hu YQ;  Zhao YP(赵亚溥)
Adobe PDF(537Kb)  |  收藏  |  浏览/下载：215/66  |  提交时间：2018/11/08
Accelerometers  Aluminum  Glass  Nanostructures  Tensile strength  Anodic bonding  Bonding temperatures  Dendritic nanostructures  Intermediate layers  MEMS/NEMS  Micro accelerometers  Micro  scale structures  Quasi  static loading  
Characteristics of a Supersonic Model Combustor with Two-Staged Injections of Supercritical Kereosen 会议论文
48th AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit, Atlanta, Georgia, July 30-Augest 1, 2012
作者:  Zhang TC(张泰昌), Yuan YM(袁岳明), Li JG(李建国) and Fan XJ(范学军)
Adobe PDF(641Kb)  |  收藏  |  浏览/下载：515/166  |  提交时间：2013/03/05
Characteristics of a supersonic model combustor with two-staged injections of supercritical kerosene 会议论文
48th AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit 2012, Atlanta, GA, United states, JUL 30-AUG 01, 2012
作者:  Zhang TC(张泰昌);  Yuan YM(袁越明);  Li JG(李建国);  Fan XJ(范学军);  Zhang TC(张泰昌)
Adobe PDF(636Kb)  |  收藏  |  浏览/下载：549/157  |  提交时间：2014/02/24
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy 会议论文
Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, Kauai, Hi, United states, July 8, 2001 - July 13, 2001
作者:  Dai LH(戴兰宏);  Lee SWR
Adobe PDF(1139Kb)  |  收藏  |  浏览/下载：133/35  |  提交时间：2017/06/01
Adiabatic Shear Localization (Asl)  
Characterization of Strain Rate-Dependent Shear Response of 63Sn/37Pb Solder under Uniaxial Torsion 会议论文
Advances in Engineering Plasticity-Part 1, Hong Kong, June 12-16, 2000, Volumes 177-180, Hong Kong, June 12-16, 2000
作者:  Dai LH(戴兰宏);  Lee SWR
Adobe PDF(1283Kb)  |  收藏  |  浏览/下载：133/44  |  提交时间：2017/06/01
Electronic Packing  Shear Strength  Sn-pb Solder  Strain Rate Effect  Torsion  
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB) 会议论文
2001 ASME International Mechanical Engineering Congress and Exposition, New York, NY, United states, November 11, 2001 - November 16, 2001
作者:  Lee SWR;  Dai LH(戴兰宏)
浏览  |  Adobe PDF(1262Kb)  |  收藏  |  浏览/下载：150/59  |  提交时间：2017/06/01
Elastic Stress  Shear Loading  Temperature Cycling  
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
作者:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
Adobe PDF(691Kb)  |  收藏  |  浏览/下载：343/85  |  提交时间：2014/02/14
Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation