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Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer 期刊论文
Thin Solid Films, 2004, 卷号: 460, 期号: 1, 页码: 175-180
Authors:  Zhou Y;  Yang CS;  Chen JA;  Ding GF,;  Ding W;  Wang L;  Wang MJ;  Zhang YM;  张泰华
Adobe PDF(269Kb)  |  Favorite  |  View/Download：2028/948  |  Submit date：2007/06/15
Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer 期刊论文
Acta Metallurgica Sinica(English Letters), 2004, 卷号: 17, 期号: 3, 页码: 247-254
Authors:  Zhou Y;  Yang CS;  Chen JA;  Ding GF;  Wang L;  Wang MJ;  Zhang YM;  Zhang TH(张泰华)
View  |  Adobe PDF(475Kb)  |  Favorite  |  View/Download：188/47  |  Submit date：2015/09/14
Nickel Film Microbridge  Mems  Mechanical Property  Loadeflection Measurement  
Numerical simulation of Richtmyer-Meshkov instability 期刊论文
Science in China Series A-Mathematics, 2004, 卷号: 47, 期号: S1, 页码: 234-244
Authors:  Fu DX(傅德薰);  Ma YW(马延文);  Zhang LB(张林波);  Tian BL(田保林);  Fu, DX (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
View  |  Adobe PDF(1265Kb)  |  Favorite  |  View/Download：789/134  |  Submit date：2009/08/03
R-m Instability  Direct Numerical Simulation  Shock-interface Interaction